US Patent Issued to DEXERIALS on July 7 for "Adhesive composition, thermosetting adhesive sheet, and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,376, issued on July 7, was assigned to DEXERIALS Corp. (Shimotsuke, Japan).

"Adhesive composition, thermosetting adhesive sheet, and printed wiring board" was invented by Jun Yamamoto (Shimotsuke, Japan), Toshiyuki Minegishi (Shimotsuke, Japan) and Kazuhiro Date (Shimotsuke, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive composition has a low dielectric constant, a low dielectric loss tangent, and an excellent folding endurance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenylene...