US Patent Issued to DEXERIALS on July 28 for "Solder particle manufacturing method, solder particle, and conductive composition" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,691,533, issued on July 28, was assigned to DEXERIALS Corp. (Tochigi, Japan).

"Solder particle manufacturing method, solder particle, and conductive composition" was invented by Sarii Yamaguchi (Tochigi, Japan), Hidetsugu Namiki (Tochigi, Japan) and Takeshi Nishio (Tochigi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder particle manufacturing method includes a curing step of curing solder particles such that a hardness K of the solder particles under compressive deformation to 70% is 850 N/mm2 or greater and 1,500 N/mm2 or less, and a classifying step of classifying the solder particles after being cured by forcibly generating an airflow ...