US Patent Issued to DENSO on Oct. 6 for "Semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,754, issued on Oct. 6, was assigned to DENSO Corp. (Kariya-city, Japan).

"Semiconductor module" was invented by Hirotoshi Kusama (Kariya-city, Japan), Naruhiro Inoue (Kariya-city, Japan), Shuna Nagai (Kariya-city, Japan), Keita Fukutani (Kariya-city, Japan), Yasushi Furukawa (Kariya-city, Japan), Takahide Kato (Kariya-city, Japan), Shunsuke Arai (Kariya-city, Japan), Ryota Miwa (Kariya-city, Japan) and Shoichiro Omae (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a semiconductor element, a heat dissipation member thermally connected to the semiconductor element, a resin member, a signal terminal, an...