US Patent Issued to DENSO on Nov. 3 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,782, issued on Nov. 3, was assigned to DENSO Corp. (Kariya-city, Japan).

"Semiconductor device" was invented by Yoichi Sasaki (Kariya-city, Japan) and Satoru Wakiyama (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a die; a mold material layer in which the die is embedded in a state where an electrode surface of the die is exposed from the mold material layer; and a redistribution layer provided on a surface of the mold material layer and having an insulating layer and a wiring in a multilayer state, as a fan out wafer level package. The wiring of the redistribution layer has a reinforcing portion t...