US Patent Issued to DENSO on May 19 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,518, issued on May 19, was assigned to DENSO Corp. (Kariya-city, Japan).

"Semiconductor device" was invented by Motomi Murozaki (Kariya-city, Japan), Yoshifumi Munakata (Kariya-city, Japan) and Masahiro Honda (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element, a substrate, a bonding member and a sealing body sealing the semiconductor element, the substrate and the bonding member. The substrate has front-face and back-face metal bodies on opposite faces of an insulating base member. The front-face metal body is electrically connected to a main electrode of the semiconductor elemen...