US Patent Issued to DENSO on May 12 for "Heat pump cycle device" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,869, issued on May 12, was assigned to DENSO Corp. (Kariya-city, Japan).

"Heat pump cycle device" was invented by Kota Takeichi (Kariya-city, Japan), Atsushi Inaba (Kariya-city, Japan), Yuichi Kami (Kariya-city, Japan), Kengo Sugimura (Kariya-city, Japan) and Daiki Kato (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump cycle device includes a compressor, a branching unit, a heating unit, a heating-unit-side depressurizing unit, a bypass passage, a bypass flow-rate adjusting unit, a mixing unit, and a target pressure difference determining unit. The target pressure difference determining unit determines a target pressure d...