US Patent Issued to DENSO on March 17 for "Semiconductor device and power converter" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,946, issued on March 17, was assigned to DENSO Corp. (Kariya-city, Japan).

"Semiconductor device and power converter" was invented by Daisuke Fukuoka (Kariya-city, Japan), Hideyuki Uehigashi (Kariya-city, Japan), Masayoshi Umezawa (Kariya-city, Japan), Masanori Ooshima (Kariya-city, Japan), Ryoji Uwataki (Kariya-city, Japan) and Takahiro Hirano (Seto-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element, a first wiring member, a second wiring member, and a terminal. The semiconductor element includes a first main electrode and a second main electrode on a side opposite from the first main...