ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,969, issued on March 17, was assigned to DENSO Corp. (Kariya-city, Japan).
"Semiconductor device" was invented by Takuya Kadoguchi (Toyota, Japan), Takanori Kawashima (Toyota, Japan), Shinji Hiramitsu (Kariya, Japan) and Shoichiro Omae (Kariya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element having a surface on which a first electrode and a second electrode are disposed, a conductor plate having a surface facing the surface of the semiconductor element and electrically connected to the first electrode, an insulating layer disposed on the surface of the conductor plate and covers a part of...