US Patent Issued to DENSO on June 2 for "Heat pump cycle device" (Japanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,630, issued on June 2, was assigned to DENSO Corp. (Kariya-city, Japan).

"Heat pump cycle device" was invented by Haruyuki Nishijima (Kariya-City, Japan), Yuichi Kami (Kariya-City, Japan) and Hiroshi Mieda (Kariya-City, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump cycle device includes: a compressor; a branch portion; a heating unit configured to heat a heating object using one refrigerant branched at the branch portion as a heat source; a decompression unit configured to decompress the refrigerant flowing out of the heating unit; a bypass passage through which an another refrigerant branched at the branch portion flows; a regulat...