US Patent Issued to DENSO on July 21 for "Semiconductor device for upper and lower arm circuits" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,471, issued on July 21, was assigned to DENSO Corp. (Kariya-city, Japan).

"Semiconductor device for upper and lower arm circuits" was invented by Takahiro Hirano (Kariya-city, Japan), Masayoshi Nishihata (Kariya-city, Japan) and Chihiro Kato (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first element for one of upper and lower arm circuits; a second element for the other of the upper and lower arm circuits; a first wiring having a first mounting portion on which the first element is disposed and a first power supply terminal portion connected with the first mounting portion; a second wiring hav...