US Patent Issued to DENSO on July 14 for "Heat pump cycle device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,680,737, issued on July 14, was assigned to DENSO Corp. (Kariya-city, Japan).

"Heat pump cycle device" was invented by Kengo Sugimura (Kariya-city, Japan), Yuichi Kami (Kariya-city, Japan) and Kota Takeichi (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump cycle device includes a compressor, a branch portion, a heating unit, a heating-unit side decompression unit, a bypass passage, a bypass-side flow-rate regulating unit, a mixing portion, and a target temperature determination unit. When a regulating performance determination unit determines that a flow rate regulating performance of one of the heating-unit side decompressi...