ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,553,863, issued on Feb. 17, was assigned to DENSO Corp. (Kariya, Japan).
"Electronic device and power module" was invented by Ryoichi Kaizu (Kariya, Japan), Yuki Inaba (Kariya, Japan), Tomomi Okumura (Kariya, Japan) and Toshifumi Hosono (Kariya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module comprises an element and an insulated circuit board having a laminated portion. The laminated portion includes a first metal layer, a bonding layer interposed between an element and the first metal layer, a second metal layer, and a resin layer interposed between the first metal layer and the second metal layer. The insulated circuit board has a...