US Patent Issued to DENSO on April 21 for "Semiconductor device and semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,831, issued on April 21, was assigned to DENSO Corp. (Kariya-city, Japan).

"Semiconductor device and semiconductor module" was invented by Seigo Oosawa (Kariya-city, Japan), Yoshihiro Inutsuka (Kariya-city, Japan), Takahiro Nakano (Kariya-city, Japan) and Yasushi Ookura (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device having a fan-out package structure includes a semiconductor element having a first electrode pad and a second electrode pad on a front surface, a sealing material covering a side surface of the semiconductor element and a redistribution layer covering the front surface of the semiconductor elem...