US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on Sept. 8 for "Circuit module having reinforcing bonding materials, and a method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,520, issued on Sept. 8, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Circuit module having reinforcing bonding materials, and a method of manufacturing the same" was invented by Yoshitaka Kato (Nisshin, Japan), Takeshi Endo (Nisshin, Japan) and Kazuhiro Tsuruta (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit module includes: a first circuit component having electrode pads on a first surface; and a second circuit component having electrode pads on a second surface. A conductive bonding material joins the electrode pads of the first circu...