US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on Oct. 27 for "Semiconductor device and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,676, issued on Oct. 27, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Semiconductor device and method of manufacturing the same" was invented by Yuichi Mori (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a semiconductor substrate having a first main surface and a second main surface, in which a first semiconductor region, a second semiconductor region, and a third semiconductor region are arranged in this order in a thickness direction of the semiconductor substrate. The third semiconductor region is exposed from ...