US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on May 19 for "Semiconductor wafer manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,480, issued on May 19, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Semiconductor wafer manufacturing apparatus" was invented by Hiroaki Fujibayashi (Nisshin, Japan), Hirotaka Mori (Nisshin, Japan), Takayuki Satomura (Nisshin, Japan) and Shigeyuki Takagi (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor wafer manufacturing apparatus includes a reaction chamber, a reactant gas supply pipe and a reactant gas discharge pipe communicated with the reaction chamber, a rotating device having a cylindrical member, a lid member disposed on on...