US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on March 17 for "Semiconductor module having a plurality of heat sink plates" (Japanese Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,951, issued on March 17, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Semiconductor module having a plurality of heat sink plates" was invented by Shohei Nagai (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a substrate, a semiconductor element and a heat sink plate. The substrate is included in a circuit board. The semiconductor element is disposed at the heat sink plate inside the substrate. A fluid is sealed inside the heat sink plate."

The patent was filed on Feb. 23, 2022, under Application No. 17/678,240. ...