US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on July 28 for "Semiconductor device and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,765, issued on July 28, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Semiconductor device and method for manufacturing the same" was invented by Masashi Uecha (Nisshin, Japan), Yuji Nagumo (Nisshin, Japan), Hiroki Tsuma (Nisshin, Japan) and Teruaki Kumazawa (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor substrate, an end region, and an active region. The end region is located above the semiconductor substrate, has a frame shape, and has been brought into contact with a blade in a scribing process. ...