US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on Aug. 25 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,719,232, issued on Aug. 25, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Semiconductor device" was invented by Naoya Take (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element, a substrate, and a plurality of wires. The semiconductor element has a plurality of electrodes on a first surface. The substrate has an element mount portion to which a second surface of the semiconductor element is joined through a solder joining material, a plurality of bonding portions disposed on a periphery of the element ...