US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies, National University Corporation Tokai National Higher Education and Research System, HAMAMATSU PHOTONICS on Sept. 8 for "Semiconductor wafer processing apparatus and method of manufacturing semiconductor element" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,461, issued on Sept. 8, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan), MIRISE Technologies Corp. (Nisshin, Japan), National University Corporation Tokai National Higher Education and Research System (Nagoya, Japan) and HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Semiconductor wafer processing apparatus and method of manufacturing semiconductor element" was invented by Shosuke Nakabayashi (Nisshin, Japan), Junji Ohara (Nisshin, Japan), Masatake Nagaya (Nisshin, Japan), Chiaki Sasaoka (Nagoya, Japan), Shoichi Onda (Nagoya, Japan), Jun Kojima (Nagoya, Japan), Daisuke Kawaguchi (Hamamatsu, Japan), Ryuji Sugiura (Hamamatsu, Japan), Toshiki Yui ...