US Patent Issued to DENKA on March 17 for "Sheet for packaging electronic part" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,622, issued on March 17, was assigned to DENKA COMPANY Ltd. (Tokyo).

"Sheet for packaging electronic part" was invented by Takeshi Saito (Tokyo), Ikuka Inoda (Tokyo) and Ryosuke Yanaka (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device packaging sheet including a substrate sheet having at least one substrate layer including: a thermoplastic resin (I); and a resin (II) which includes at least one copolymer selected from a (meth)acrylic acid alkyl ester copolymer (A) and a styrene-acrylonitrile copolymer (B) that have a weight-average molecular weight of 700,000-4,300,000. The substrate sheet has at least one substrate layer c...