US Patent Issued to DENKA on July 14 for "Heat dissipation member" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,158, issued on July 14, was assigned to DENKA COMPANY Ltd. (Tokyo).

"Heat dissipation member" was invented by Daisuke Goto (Tokyo) and Hiroaki Ota (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a heat dissipation member according to the present invention that includes a flat metal-silicon carbide composite containing aluminum, the heat dissipation member including: at least one through hole that penetrates the flat metal-silicon carbide composite in a plate thickness direction; a tapered portion where an inner diameter of the through hole gradually increases toward an outer side in a periphery of one or both end portions of the th...