ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,698,418, issued on Aug. 4, was assigned to DENKA COMPANY Ltd. (Tokyo).
"Adhesive composition, bonded body and production method for an adhesive composition" was invented by Yusuke Takahashi (Tokyo), Chiaki Takano (Tokyo) and Hiroyuki Kurimura (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive composition including a polymerizable monomer having a (meth)acryloyl group; a radical polymerization initiator; and a polymer particle having a property of being swollen by an organic solvent, in which in a particle size distribution of secondary particles which are aggregates of the polymer particles, the secondary particles being in the adhesive co...