US Patent Issued to Demcon Bond 3D on April 7 for "Extrusion-based additive manufacturing: method and 3D printing system" (Dutch Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,594,727, issued on April 7, was assigned to Demcon Bond 3D B.V. (Enschede, Netherlands).

"Extrusion-based additive manufacturing: method and 3D printing system" was invented by Bahri Sinan Inanc (Enschede, Netherlands), Tom Wimmenhove (Enschede, Netherlands) and Guus Kuiper (Enschede, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for enabling an extrusion-based AM 3D printing system to handle individual 3D parts of a print job having at least two 3D parts. The method includes slicing the print job to generate a set of slices for the digital 3D representations of the 3D parts. Each slice having geometrical data defining boundaries o...