US Patent Issued to Dell Products on Sept. 8 for "System for attaching a thermal interface material to a heat sink" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,106, issued on Sept. 8, was assigned to Dell Products LP (Round Rock, Texas).

"System for attaching a thermal interface material to a heat sink" was invented by Enoch Chen (Taipei City, Taiwan), Ping-Sheng Kao (Hsinchu City, Taiwan), Ryan Lee (Taipei City, Taiwan) and Travis C. North (Cedar Park, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system for attaching a thermal interface material (TIM) to a heat sink positioned on a base layer, the heat sink having a heat sink length and a heat sink width, the system including a plurality of treated sections of the base layer around at least a portion of a perimeter of the heat sink, wherein each...