US Patent Issued to Dell Products on April 7 for "Flip chip package" (Texas Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,016, issued on April 7, was assigned to Dell Products LP (Round Rock, Texas).

"Flip chip package" was invented by Qinghong He (Austin, Texas) and Isaac Qin Wang (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one or more embodiments, a chip may be formed with a first set of contacts on a first surface layer and a second set of contacts on a second surface layer opposite the first surface layer. The first set of contacts may be communication (IO) contacts and the second set of contacts may be power contacts, including ball grid array (BGA) balls and capacitors. A PCB may be configured with a chip receiving area capable of receiving t...