US Patent Issued to Dell Products on April 21 for "Integrated circuit (IC) assembly including a direct connection pad structure for a surface-mount device (SMD)" (Texas Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,472, issued on April 21, was assigned to Dell Products LP (Round Rock, Texas).

"Integrated circuit (IC) assembly including a direct connection pad structure for a surface-mount device (SMD)" was invented by Bhyrav M. Mutnury (Round Rock, Texas), Sandor Tibor Farkas (Round Rock, Texas) and James Lewis Petivan (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An IC assembly, including a PCB, including a first stripline; a ground layer; a first cavity extending from the PCB to the first stripline; a second cavity extending from the PCB to the ground layer; wherein the first cavity includes first solder paste in contact with the first porti...