US Patent Issued to Deca Technologies USA on March 31 for "Molded bridge with vertical interconnects and method of making the same" (Arizona, California Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,703, issued on March 31, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Molded bridge with vertical interconnects and method of making the same" was invented by Craig Bishop (Scottsdale, Ariz.) and Paul R. Hoffman (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic assembly with a molded bridge, vertical interconnects and encapsulant disposed around vertical interconnects. A first build-up interconnect structure disposed over the encapsulant and the vertical interconnects, through conductive interconnects disposed in a periphery of the molded bridge, a second encapsulant disposed over the molded bridge and around th...