US Patent Issued to Deca Technologies USA on June 16 for "Layered molded direct contact and dielectric structure and method for making the same" (California, Washington, Minnesota, Arizona Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,638, issued on June 16, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Layered molded direct contact and dielectric structure and method for making the same" was invented by Robin Davis (Vancouver, Wash.), Timothy L. Olson (Phoenix), Clifford Sandstrom (Richfield, Minn.), Craig Bishop (Scottsdale, Ariz.) and Paul R. Hoffman (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making a semiconductor assembly may include providing a semiconductor component disposed within a first encapsulant, the encapsulant being disposed around and contacting at least four side surfaces of the semiconductor component and disposed over f...