US Patent Issued to DDP SPECIALTY ELECTRONIC MATERIALS US on May 12 for "High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers" (Swiss Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,262, issued on May 12, was assigned to DDP SPECIALTY ELECTRONIC MATERIALS US LLC (Wilmington, Del.).

"High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers" was invented by Felix Koch (Altendorf, Switzerland), Sergio Grunder (Zurich, Switzerland) and Andreas Lutz (Galgenen, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "One-component toughened epoxy structural adhesives contain fibrous mineral fillers that have an aspect ratio of less than=6. The presence of the fibrous filler leads to a significant increase in elastic modulus while having little if any adverse effect on other properties such as d...