US Patent Issued to DDP SPECIALTY ELECTRONIC MATERIALS, DUPONT MATERIALS TECHNOLOGY (SHANGHAI) on May 26 for "Adhesive system" (Chinese, Swiss Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,874, issued on May 26, was assigned to DDP SPECIALTY ELECTRONIC MATERIALS LLC (Wilmington, Del.) and DUPONT MATERIALS TECHNOLOGY (SHANGHAI) Co. LTD (Shanghai).

"Adhesive system" was invented by Yiqing Hu (Shanghai) and Sergio Grunder (Freienbach, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided herein is a method for dissembling adhered substrates."

The patent was filed on Nov. 10, 2022, under Application No. 18/694,206.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTX...