US Patent Issued to DB HiTek on March 31 for "Backside illuminated image sensor and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,522, issued on March 31, was assigned to DB HiTek Co. Ltd. (Bucheon-si, South Korea).

"Backside illuminated image sensor and manufacturing method thereof" was invented by Sang Won Yun (Daegu, South Korea), Ju Hwan Jung (Seoul, South Korea) and Tae Wook Kang (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a backside illuminated image sensor and a method of manufacturing the same. More particularly, a backside illuminated image sensor and a method of manufacturing the backside illuminated image sensor include a light scattering portion in a substrate configured to converge a path of incident light to a photoelectr...