US Patent Issued to DANFOSS SILICON POWER on March 17 for "Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor" (German Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,983, issued on March 17, was assigned to DANFOSS SILICON POWER GMBH (Flensburg, Germany).

"Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor" was invented by Andre Bastos Abibe (Flensburg, Germany), Frank Osterwald (Flensburg, Germany), Jacek Rudzki (Flensburg, Germany), Martin Becker (Flensburg, Germany), Ronald Eisele (Flensburg, Germany) and David Benning (Flensburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for formi...