US Patent Issued to DANA CANADA on April 7 for "Thick film printed cooler for improved thermal management of direct bonded power devices" (Canadian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,693, issued on April 7, was assigned to DANA CANADA Corp. (Oakville, Canada).

"Thick film printed cooler for improved thermal management of direct bonded power devices" was invented by Matthew S. Birkett (Toronto) and Andrei Catuneanu (Oakville, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cooler assembly, comprising: a heat exchanger with a heat exchanger surface having a dielectric layer of dielectric material physically coupled thereto, wherein a single or plurality of layers of another material are coupled to an exposed surface of the dielectric layer; and at least one component coupled to the heat exchanger such that the at least one...