ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,389, issued on Oct. 20, was assigned to DAIWA Co. LTD. (Nagano, Japan).
"Method for manufacturing wiring board or wiring board material" was invented by Eiji Yoshimura (Okaya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a wiring board or a wiring board material includes: obtaining a laminated body LB including the wiring board or the wiring board material having an opening, an embedded member 14 positioned inside the opening, and a cured product of a filling sheet or a coating layer that is integrated with the wiring board or the wiring board material and contains a thermosetting resin 17, the thermosetting resin ...