US Patent Issued to DAIKIN INDUSTRIES on March 24 for "Heat exchanger, heat pump device, and method of manufacturing heat exchanger" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,042, issued on March 24, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan).

"Heat exchanger, heat pump device, and method of manufacturing heat exchanger" was invented by Kouju Yamada (Osaka, Japan) and Tomoki Hirokawa (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat exchanger includes: a header; and heat transfer tubes connected to the header. The header includes a first member, a second member, and a third member. A brazing layer between the second member and the third member has a melt rate, at predetermined temperature, that is larger than a melt rate, at the predetermined temperature, of at least one of: a brazing layer ...