US Patent Issued to DAIKIN INDUSTRIES on June 9 for "Heat pump apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,251, issued on June 9, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan).

"Heat pump apparatus" was invented by Ikuhiro Iwata (Osaka, Japan), Eiji Kumakura (Osaka, Japan), Tetsushi Tsuda (Osaka, Japan), Shinjiro Domi (Osaka, Japan) and Atsushi Yoshimi (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An air conditioner, which is a heat pump apparatus, includes a refrigerant circuit, a compressor, and a composition adjustment mechanism. The refrigerant circuit circulates a non-azeotropic mixture refrigerant including a first refrigerant and a second refrigerant having a boiling point higher than the first refrigerant. The compressor com...