US Patent Issued to DAIKIN FINETECH on June 23 for "Substrate processing module and substrate processing device provided with same" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,693, issued on June 23, was assigned to DAIKIN FINETECH LTD. (Yamatokoriyama, Japan).

"Substrate processing module and substrate processing device provided with same" was invented by Yasunori Deguchi (Yamatokoriyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing module of a substrate processing device includes a first tank and a second tank and that are arranged in a first direction and in which a substrate can be disposed, and two first transport units and that transport the substrate. One first transport unit includes a second chuck that is movable up and down and is disposed in the second tank in a state of holding t...