US Patent Issued to Dai Nippon Printing on Sept. 8 for "Wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,092, issued on Sept. 8, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo).

"Wiring board" was invented by Hiroki Furushou (Tokyo), Atsuko Chigira (Tokyo), Toshio Sasao (Tokyo) and Hiroshi Mawatari (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the fi...