US Patent Issued to Dai Nippon Printing on June 30 for "Curable resin composition for silicon-containing resist, pattern forming method, method for producing imprint mold, and method for producing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,749, issued on June 30, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo).

"Curable resin composition for silicon-containing resist, pattern forming method, method for producing imprint mold, and method for producing semiconductor device" was invented by Yasuhiro Okawa (Tokyo-to, Japan), Shintaro Nasu (Tokyo-to, Japan), Masakazu Kaneko (Tokyo-to, Japan) and Hirokazu Oda (Tokyo-to, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A curable resin composition for silicon-containing resist including a polymerizable compound, and a polymerization initiator, wherein the polymerizable compound includes a siloxane bond in a molecule, and includes at ...