US Patent Issued to D2S on Aug. 18 for "Mask optimization for first layer that accounts for other layers" (California Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,710,694, issued on Aug. 18, was assigned to D2S INC. (San Jose, Calif.).

"Mask optimization for first layer that accounts for other layers" was invented by Donald Oriordan (Sunnyvale, Calif.) and Akira Fujimura (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments provide a method for optimizing a mask layout for producing masks that are used for manufacturing an integrated circuit (IC) comprising multiple layers of components. The method receives a mask layout including a set of mask images corresponding to a first layer of components of the IC that is adjacent to at least a second layer of components. The method generates a...