US Patent Issued to CUNEX on Oct. 20 for "Coated metal foil of copper or a copper alloy and method for producing a coated metal foil of copper or a copper alloy" (German Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,596, issued on Oct. 20, was assigned to CUNEX GMBH (Ingolstadt, Germany).

"Coated metal foil of copper or a copper alloy and method for producing a coated metal foil of copper or a copper alloy" was invented by Sri Krishna Bhogaraju (Ingolstadt, Germany) and Gordon Elger (Ingolstadt, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A coated metal foil for forming a copper-containing interlayer between a first solid substrate and a second solid substrate or between a solid substrate. The coated metal foil includes a metal foil of copper or of a first copper alloy or of a copper plated nickel-iron alloy. The metal foil has a first surface and a ...