US Patent Issued to CR RUNAN TECHNOLOGIES (CHONGQING) on Nov. 3 for "Manufacturing method for a die including forming a copper layer using electroless plating with zinc displacement reaction" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,845, issued on Nov. 3, was assigned to CR RUNAN TECHNOLOGIES (CHONGQING) Co. LTD. (Chongqing, China).

"Manufacturing method for a die including forming a copper layer using electroless plating with zinc displacement reaction" was invented by Weiyuan Yang (Chongqing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a die, a manufacturing method of the die, a chip packaging structure and a manufacturing method of the chip packing structure. The die includes an aluminum bonding pad, a passivation layer and a copper layer. The aluminum bonding pad and the passivation layer are both on an active surface of the die, and ...