ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,467, issued on July 21, was assigned to CR Runan Technologies (Chongqing) Co. Ltd. (Chongqing, China).
"Semiconductor packaging method" was invented by Weiyuan Yang (Chongqing, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor packaging method is provided. The method includes: providing a carrier, where the carrier includes an attachment region for attaching a chip; forming a bonding layer, where an orthographic projection of the bonding layer on the carrier at least covers the attachment region, and the bonding layer is in a form of a film layer and uncured; attaching the chip onto the bonding layer, where the chip includes a fir...