US Patent Issued to CR RUNAN TECHNOLOGIES (CHONGQING) on April 21 for "Semiconductor encapsulation method and semiconductor encapsulation structure" (Chinese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,846, issued on April 21, was assigned to CR RUNAN TECHNOLOGIES (CHONGQING) Co. LTD. (Chongqing, China).

"Semiconductor encapsulation method and semiconductor encapsulation structure" was invented by Jimmy Chew (Chongqing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor encapsulation method, comprising: forming a protection layer on a front side of a chip to be encapsulated; arranging said chip, with the protection layer being formed on the front side thereof, on a carrier plate, wherein the front side of said chip faces upwards and a back side thereof faces the carrier plate; and encapsulating, on the carrier plate, said chip a...