US Patent Issued to CORNING on May 26 for "Support structures for accommodating thermal expansion and glass manufacturing apparatuses comprising the same" (New York, Pennsylvania Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,637,379, issued on May 26, was assigned to CORNING Inc. (Corning, N.Y.).

"Support structures for accommodating thermal expansion and glass manufacturing apparatuses comprising the same" was invented by JinSoo Kim (Corning, N.Y.), Eric Lee Miller (Corning, N.Y.), Brian Michael Palmer (Corning, N.Y.) and Tytus Lee Zimmerman (Columbia Cross Roads, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A glass manufacturing apparatus includes a stir chamber disposed on a base. The stir chamber includes an entry port attached to a first connector tube, a chamber conduit, and an elbow conduit. The apparatus also includes a second connector tube connected to the el...