US Patent Issued to Coretronic on Oct. 6 for "Heat dissipation module and projection device" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,754,465, issued on Oct. 6, was assigned to Coretronic Corp. (Hsin-Chu, Taiwan).

"Heat dissipation module and projection device" was invented by Cheng-Han Lu (Hsin-Chu, Taiwan) and Min-Hsueh Lee (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module disposed in a projection device and dissipating heat from a heat source includes a heat dissipation member, a thermoelectric cooler, a heat conduction member, and a sealant. The thermoelectric cooler has a heat absorbing surface, a heat dissipating surface contacting the heat dissipation member, and a first side surface adjacent between the heat absorbing surface and the hea...