ALEXANDRIA, Va., July 15 -- United States Patent no. 12,665,344, issued on June 23, was assigned to Connecteurs Electriques Deutsch (Evreux, France) and Tyco Electronics UK Ltd. (Swindon, Great Britain).
"Modular backshell housing" was invented by Jean-Luc Moreau (Evreux, France), Martin Paul (Swindon, Great Britain) and Ralf Styles (Swindon, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "A backshell housing includes a pair of housing parts including a first housing part and a second housing part friction welded to one another. A cable passage of the first housing part is continuous with a cable passage of the second housing part. At least one of the housing parts has a welding protrusion recei...