US Patent Issued to Commissariat a l'Energie Atomique et aux Energies Alternatives on Aug. 25 for "Method of assembly by direct bonding of electronic components" (French Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,248, issued on Aug. 25, was assigned to Commissariat a l'Energie Atomique et aux Energies Alternatives (Paris).

"Method of assembly by direct bonding of electronic components" was invented by Frank Fournel (Grenoble, France), Christophe Morales (Grenoble, France), Loic Sanchez (Grenoble, France) and Brigitte Montmayeul (Grenoble, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of preparation of a first surface of an electronic component, the first surface being intended to be bonded to another electronic component by a direct bonding and the first surface having previously been submitted to a surface treatment in an atmosphere includi...