US Patent Issued to CJ Logistics on July 14 for "Shock-absorbing material for packaging" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. D1,133,908, issued on July 14, was assigned to CJ Logistics Corp. (Seoul, South Korea).

"Shock-absorbing material for packaging" was invented by Soo Hyung Lee (Seoul, South Korea), Ju Hwan Yoo (Seoul, South Korea), Hye Yeon Jeong (Seoul, South Korea), Ja Hyun Koo (Seoul, South Korea), Oh Sung Kwon (Seoul, South Korea), Jung Hoon Park (Seoul, South Korea), Hyun Woo Yang (Seoul, South Korea), Yu Mi Jeong (Seoul, South Korea) and Chan Woo Kim (Seoul, South Korea).

The patent was filed on Feb. 11, 2025, under Application No. D/524,909.

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